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 Windsor uses a wide variety of automated equipment that allows us to accommodate orders of any magnitude efficiently and economically. Windsor is capable of placing micro ball grid array devices and is able to produce low to high volume runs.
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- Assembly
Wide variety of automatic equipment allows us to accommodate orders of any magnitude efficiently and economically.
- Surface Mount
Windsor produces a wide variety of SMT printed circuit board assemblies utilizing our “State of the Art” Samsung pick and place equipment. Capabilities include 01005 components through 50mm x 50mm .4mm micro BGAs. Our flexible approach allows us to adapt our manufacturing processes to accommodate prototype to full-volume production, along with short or long runs. Process validation is accomplished using Automated Optical Inspection (AOI) with real time shop floor data capture work stations.
- Through-hole
Fully automated assembly equipment for axial, radial, and dip insertion. Wave solder available for both aqueous or "no clean."
- Testing
In-circuit and functional testing capabilities performed in-house.
- Conformal Coating
Fully automated conformal coating services.
- View our facilities list
- Contact us to find out more information
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