Header
 

Windsor continues to successfully compete against foreign contract assembly companies. OEMs are weighing the risks and costs associated with foreign companies and finding that domestic contractors are providing comparable services at a competitive price.

The performance of our company through the years clearly demonstrates our ability to provide a competitive complete service package. Windsor's strategy is to cultivate strong manufacturing relationships with established and emerging OEMs in the electronics industry.








Printed Circuit Board Assembly


Windsor uses a wide variety of automated equipment that allows us to accommodate orders of any magnitude efficiently and economically. Windsor is capable of placing micro ball grid array devices and is able to produce low to high volume runs.

We offer fully automated assembly equipment for surface mount as well as axial, radial, and dip insertion. Our testing capabilities including aqueous and "no clean" for in-circuit and functional testing are performed in-house.


Assembly

Wide variety of automatic equipment allows us to accommodate orders of any magnitude efficiently and economically.

Surface Mount

Six (6) automated high-speed pick and place lines with "vision centering." Capable of placing components ranging from 12 mil pitch devices. Production capability from low to high volume runs.

Through-hole

Fully automated assembly equipment for axial, radial, and dip insertion. Wave solder available for both aqueous or "no clean."

Testing

In-circuit and functional testing capabilities performed in-house.


Conformal Coating

Fully automated conformal coating services.



View our facilities list

Contact us to find out more information